Method of assembling semiconductor integrated circuit

Details Method of assembling semiconductor integrated circuit Method of assembling semiconductor integrated circuit

1978-05-23

1980-12-09

Husar, Francis S.

Metal working

Method of mechanical manufacture

Electrical device making

29841, 29557R, 174 685, 427282, H05K 334

Patent

active

042376076

ABSTRACT:
A method of assembling a semiconductor integrated circuit in which a semiconductor integrated circuit chip with bumps is bonded to a flexible film circuit substrate. The assembling method of the invention comprises a step of making the highest layer of the bump of solder or a low melting point metal treating the surface of the flexible film circuit substrate by gold-plating, and bonding the semiconductor integrated circuit chip and the flexible film circuit substrate with the former mounted face-down on the latter.

REFERENCES:
patent: 3373481 (1968-03-01), Lins et al.
patent: 3403438 (1968-10-01), Best et al.
patent: 3429040 (1969-02-01), Miller
patent: 3495133 (1970-02-01), Miller
patent: 3561107 (1971-02-01), Best et al.
patent: 3647533 (1972-03-01), Hicks
patent: 3724068 (1973-04-01), Galli
patent: 3739462 (1973-06-01), Hasty

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