Method of connecting an element having multiple terminals and a

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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100 38, 100211, 156212, 156285, 156286, 156306, 156580, B29C 2702, B32B 3126

Patent

active

041599217

ABSTRACT:
A connection apparatus mainly comprises a gas-tight container one surface of which is made of a film, a gas supply source for filling the container with a gas at a predetermined pressure, and a heat source. Two substrates, at least one of which is flexible, are tightly supported on the film surface of the container in such a manner that electrodes or terminals formed on the both substrates confront with each other. The gas pressure in the container is increased to the predetermined value, thereby to tightly contact the electrodes formed on the both substrates with each other. Thereafter, the heat source is enabled to melt the electrodes and to electrically connect the two substrates with each other.

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patent: 3674592 (1972-07-01), Jacobson et al.
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patent: 3962278 (1976-06-01), Bower et al.
patent: 3964958 (1976-06-01), Johnston
patent: 3983275 (1976-09-01), Winter et al.

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