Method for fabrication vertical NPN and PNP structures utilizing

Metal treatment – Compositions – Heat treating

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29576B, 29576C, 29576W, 148175, 148187, 148190, 148191, 156643, 156648, 156653, 156662, 357 15, 357 44, 357 46, 357 50, 357 91, 357 92, 427 84, H01L 21265, H01L 2174

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041599152

ABSTRACT:
A method is given for fabricating vertical NPN and PNP structures on the same semiconductor body. The method involves providing a monocrystalline semiconductor substrate having regions of monocrystalline silicon isolated from one another by isolation regions. Buried regions are formed overlapping the juncture of the substrate and epitaxial layer and are located in at least one of the regions of isolated monocrystalline silicon. The P base region in the NPN designated regions and a P reach-through in the PNP designated regions are formed simultaneously. The emitter region in the NPN regions and base contact region in the PNP regions are then formed simultaneously. The P emitter region in the PNP regions is then implanted by suitable ion implantation techniques. A Schottky Barrier collector contact in the PNP regions are formed. Electrical contacts are then made to the PNP and NPN transistor elements. A PNP device may be fabricated without the formation of an NPN device if it is so desired.

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