Method for electroplating

Details Method for electroplating Method for electroplating

1977-01-10

1978-01-10

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204224R, C25D 506, C25D 534, C25D 1714

Patent

active

040677818

ABSTRACT:
An improved method and composition for plating a workpiece with tin, cadmium, lead, or indium which involves first applying an aqueous electrolyte to the substrate with a rubbing action and without electroplating voltage being applied and then applying the electroplating voltage to an anode composed of one of the aforementioned metals, utilizing the same aqueous electrolyte to plate metal from the anode onto the substrate. The aqueous electrolyte contains dissolved free sulfamic acid in concentrations up to saturation, and the electrolyte is substantially devoid of ions of a plateable metal. The electrolyte preferably includes a small amount of a surface active wetting agent.

REFERENCES:
patent: 2318592 (1943-05-01), Cupery
patent: 2489523 (1949-11-01), Clifton
patent: 3746627 (1973-07-01), Rapids
patent: 3755089 (1973-08-01), Rapids
patent: 3769182 (1973-10-01), Hsu

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