Platinum-aluminum connection system

Details Platinum-aluminum connection system Platinum-aluminum connection system

1992-07-27

1993-08-03

Padgett, Marianne

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427576, 427 96, 427123, 427125, 4271265, B05D 306, B05D 512

Patent

active

052327477

ABSTRACT:
An improved method for making aluminum connections to platinum electrodes is described. The method utilizes an oxide layer to isolate the aluminum from the platinum. The oxide layer is created by ashing the surface of the platinum using an Oxygen plasma.

REFERENCES:
patent: 3632498 (1968-02-01), Beer
patent: 4276144 (1981-06-01), Hahn et al.
patent: 4323589 (1982-04-01), Ray et al.
patent: 4390405 (1983-06-01), Hahn et al.
patent: 4765864 (1988-08-01), Holland et al.
patent: 5110441 (1992-05-01), Kinlen et al.
patent: 5164808 (1992-11-01), Evans, Jr. et al.

Affiliated with

Also associated with

Rating

Platinum-aluminum connection system does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Platinum-aluminum connection system, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Platinum-aluminum connection system will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2269053