Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1992-05-26
1993-08-03
Simmons, David A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 87, 156295, 156358, 156362, 156556, 29740, 29741, 29832, 29853, B32B 3100
Patent
active
052325326
ABSTRACT:
The present invention is to provide a chip device bonding machine in which bubbles can be effectively prevented from remaining with the adhesive. A flexible board is moved on a base at every unit by the rotation of reels. In accordance with the movement of the flexible board, a new portion of a tape made of a film, a paper or the like is moved above the base. The tape is located between the flexible board and the base. A thermosetting adhesive is deposited on the flexible board on the base by an adhesive nozzle. An IC chip is placed on the flexible board on the base by an IC chip supply arm. A pressing arm including a heater presses and heats the IC chip toward the base side to interconnect the IC chip to the flexible hoard. When the IC chip is heated and pressed by the pressing arm, the tape is concaved at its portions corresponding to bumps and consequently the flexible board is deformed, whereby bubbles produced within the adhesive are pushed out to the outside. Thus, the bubbles can be removed from the adhesive.
REFERENCES:
patent: 3855034 (1974-12-01), Miller
patent: 4216577 (1980-08-01), Badet et al.
patent: 4526646 (1985-07-01), Suzuki et al.
patent: 4672742 (1987-06-01), Juan
patent: 4749120 (1988-06-01), Hatada
patent: 4913336 (1990-04-01), Yamazaki
Rivard Paul M.
Simmons David A.
Sony Corporation
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