Thermistor bonded to thermally conductive plate

Electrical resistors – Resistance value responsive to a condition – Current and/or voltage

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338 25, H01C 704

Patent

active

042517923

ABSTRACT:
A thermistor assembly comprises a disc type thermistor bonded to a layer of a low expansion alloy which, in turn, is bonded to a thermally conductive plate. Interposition of the low expansion alloy between the thermistor and the plate substantially prevents the formation of hairline cracks in the thermistor that could result from thermal cycling.

REFERENCES:
patent: 2405192 (1946-08-01), Davis
patent: 3381253 (1968-04-01), Sapotf et al.
patent: 3896409 (1975-07-01), Micheli et al.
patent: 4131657 (1978-12-01), Ball, Jr. et al.

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