Method of planarizing metal layer

Details Method of planarizing metal layer Method of planarizing metal layer

1991-03-19

1992-03-31

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437203, 148DIG93, H01L 21268, H01L 21283

Patent

active

051008343

ABSTRACT:
A planarization method includes the steps of forming a second layer on a first layer which has an alignment mark having a heat sink structure, where the second layer is made of a metal, and irradiating a pulse energy beam on the entire exposed surface of the second layer to planarize the second layer. The heat generated in the second layer on the alignment mark is released via the first layer so that substantially no melting of the second layer occurs on the alignment mark.

REFERENCES:
patent: 4920070 (1990-04-01), Mukai

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