Method of encapsulating semiconductor devices using a lead frame

Details Method of encapsulating semiconductor devices using a lead frame Method of encapsulating semiconductor devices using a lead frame

1996-01-10

1997-09-30

Niebling, John

Fishing, trapping, and vermin destroying

437211, 437216, 437217, 437220, 26427217, H01L 2160

Patent

active

056725507

ABSTRACT:
A method of manufacturing semiconductor devices in which a multi-series lead frame that is constructed so as to assemble semiconductor elements in a state that these elements are arrayed in a plurality of series along the longer sides of the lead frame, is set in a mold, and molding resin is injected into cavities of the mold, to thereby form packages for packing the semiconductor elements in a sealing manner. In the method, a resin tablet is positioned so that resin paths are extended at substantially equal lengths to the cavities on the lead frame set in the mold, and the molding resin is injected into the cavities disposed around the resin tablet by pressing the resin tablet with a plunger.

REFERENCES:
patent: 4554126 (1985-11-01), Sera
patent: 5275546 (1994-01-01), Fierkens
patent: 5326243 (1994-07-01), Fierkens
patent: 5435953 (1995-07-01), Osada et al.

Affiliated with

Also associated with

Rating

Method of encapsulating semiconductor devices using a lead frame does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of encapsulating semiconductor devices using a lead frame, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of encapsulating semiconductor devices using a lead frame will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2256448