Panel board for integrated circuit packages

Equipment for production – distribution – or transformation of ene – Energy conversion or transformation

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

D1303

Patent

active

D02582813

REFERENCES:
patent: D235264 (1975-06-01), Murphy
Api/Amp Terminal & Connector Handbook, 1972, p. 551, Standard Series Panels.
Electronic Molding Corp. Product Bulletin, FS-18, High Density Nurl-Loc, i.c. Panel.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Panel board for integrated circuit packages does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Panel board for integrated circuit packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Panel board for integrated circuit packages will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2255745

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.