Coating apparatus – Gas or vapor deposition – With treating means
Patent
1995-08-23
1997-09-30
Niebling, John
Coating apparatus
Gas or vapor deposition
With treating means
31323131, C23C 1600
Patent
active
056722087
ABSTRACT:
A plasma discharge apparatus formed with a plasma chamber in which discharge is carried out wherein use is made, as the discharge gas sealed in the plasma chamber, of a mixed gas represented by Ne.sub.100-x Ar.sub.x A.sub.y (wherein, A is Ar, Kr, and/or Xe, x is 10 to 30 percent by volume, and y is 1 to 10 percent by volume). Note that when Kr and Xe are included as A, it is preferable that the Kr be included in an amount of 1 to 5 percent by volume and the Xe in an amount of 1 to 5 percent by volume.
REFERENCES:
patent: 4368465 (1983-01-01), Hirakawa et al.
patent: 4613855 (1986-09-01), Person et al.
patent: 4841556 (1989-06-01), Kato et al.
patent: 5086257 (1992-02-01), Gay et al.
Patent Abstracts of Japan, E-1492, p. 158 JP,A 05-266804 (Noritake Co. Ltd), Oct. 15, 1993.
KR 8702196 B (Gold Star Co.), Dec. 28, 1987.
Derwent Abstract Accession No. 95 010224/04 Class VO5, JP,A, 06-295674 (Fujitsu General ltd.), Oct. 21, 1994.
Chang Joni Y.
Niebling John
Sony Corporation
LandOfFree
Plasma discharge apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plasma discharge apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plasma discharge apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2254201