Packaged semiconductor device suitable to be mounted and connect

Details Packaged semiconductor device suitable to be mounted and connect Packaged semiconductor device suitable to be mounted and connect

1994-03-10

1998-03-03

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257704, H01L 2302, H01L 2312

Patent

active

057239045

ABSTRACT:
A package semiconductor device comprises an insulating substrate having an upper surface formed with a plurality of connection pads and an under surface formed with a plurality of external connection members each of which is electrically connected to a corresponding one of the connection pads through a via hole formed through the insulating substrate. An integrated circuit chip is bonded facedown on the upper surface of the insulating substrate so that the integrated circuit chip is electrically connected to the connection pads through solder bumps. An electrically conductive cap is covered on the first surface of the insulating substrate so that the integrated circuit chip is encapsulated in a space defined by the insulating substrate and the conductive cap. A back electrode of the integrated circuit chip is electrically connected to the conductive cap through an electrically conducting element.

REFERENCES:
patent: 4751482 (1988-06-01), Fukuta et al.
patent: 5045922 (1991-09-01), Kodoma
patent: 5067007 (1991-11-01), Kanji et al.
patent: 5081067 (1992-01-01), Shimizu et al.
patent: 5166773 (1992-11-01), Temple
patent: 5237204 (1993-08-01), Val
patent: 5306948 (1994-04-01), Yamado et al.
patent: 5311059 (1994-05-01), Banerji et al.
IBM Technical Disclosure Bulletin, vol. 31, No. 4, Sep. 1988 New York pp. 37372-37373 "Thermal Enhancement of Thermal Cap".

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