Stock material or miscellaneous articles – All metal or with adjacent metals – Plural layers discontinuously bonded
Patent
1992-07-09
1995-03-28
Zimmerman, John
Stock material or miscellaneous articles
All metal or with adjacent metals
Plural layers discontinuously bonded
428586, 428593, 228118, 228157, B23K 2018
Patent
active
054015839
ABSTRACT:
A stack of metallic sheets is constructed for selective diffusion bonding followed by superplastic forming to yield a metallic sandwich structure. The invention resides in the provision of gas distribution channels in the stack for assuring balanced and complete distribution of gas throughout the unbonded areas of the stack. The gas is used for expansion of the stack into a sandwich structure during the step of superplastic forming. The novel construction of each channel comprises superimposed grooves in opposed face sheets of the stack and slots in the core sheet(s) of the stack.
REFERENCES:
patent: 3297082 (1967-01-01), Tranel et al.
patent: 3933442 (1976-01-01), Carroll et al.
patent: 4220276 (1980-09-01), Weisert et al.
patent: 4292376 (1981-09-01), Hustler
patent: 4331284 (1982-05-01), Schulz et al.
patent: 4361262 (1982-11-01), Israeli
patent: 4434930 (1984-03-01), Trenkler et al.
patent: 4577797 (1986-03-01), Raymond
patent: 4820355 (1989-04-01), Bampton
patent: 5118026 (1992-06-01), Stacher
patent: 5139887 (1992-08-01), Sutton
patent: 5205467 (1993-04-01), Sarkisian et al.
Sarkisian Seb R.
Stacher George W.
Lewis Terrell P.
Nguyen N. M.
Rockwell International Corporation
Silberberg Charles T.
Zimmerman John
LandOfFree
Gas manifolding for super plastic forming and diffusion bonding does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Gas manifolding for super plastic forming and diffusion bonding , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Gas manifolding for super plastic forming and diffusion bonding will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2249326