Method for testing integrated circuits which are on printed circ

Details Method for testing integrated circuits which are on printed circ Method for testing integrated circuits which are on printed circ

1999-05-14

2000-10-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 22818021, H05K 330

Patent

active

061288187

ABSTRACT:
An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.

REFERENCES:
patent: 3612955 (1971-10-01), Butherus et al.
patent: 3887997 (1975-06-01), Hartleroad et al.
patent: 3911568 (1975-10-01), Hartleroad et al.
patent: 3911569 (1975-10-01), Hartleroad et al.
patent: 3937386 (1976-02-01), Hartleroad et al.
patent: 4620663 (1986-11-01), Odashima et al.

Affiliated with

Also associated with

Rating

Method for testing integrated circuits which are on printed circ does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for testing integrated circuits which are on printed circ, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for testing integrated circuits which are on printed circ will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2248209