Clamp for securing an encased power frame to a heat sink

Details Clamp for securing an encased power frame to a heat sink Clamp for securing an encased power frame to a heat sink

Filed on

1979-03-08

Date issued

1981-03-31

Examiner

James, Andrew J.

Patent Class

Electricity: conductors and insulators

SubClass

Feedthrough or bushing

SubSubClass

Compression

Other Related Categories

357 79, 357 72, 174 16HS, 165 80, H01L 2302, H01L 2328, H01L 2342

Type

Patent

Status

active

Patent number

042596858

Description

ABSTRACT:
A semiconductor device, comprising a lead frame connected to an IC chip in a resinous block and a metallic strip projecting unilaterally from that block along a heat sink, is fastened to that heat sink by a screw traversing aligned holes in the projecting strip portion and in an overlying clamp. The latter has a body of resilient sheet metal, such as brass, bent into a casing around the projecting strip portion and a cantilevered tongue overlying the resinous block, a projection on that tongue bearing upon the block under pressure of the fastening screw.

REFERENCES:
patent: 3548927 (1970-12-01), Spurling
patent: 3694703 (1972-09-01), Wilens
patent: 3786317 (1974-01-01), Thierfelder
patent: 4054901 (1977-10-01), Edwards et al.
patent: 4095253 (1978-06-01), Yoshimura
patent: 4100566 (1978-07-01), Okikawa et al.
IERC Bulletin, A New Dissipator for Double Dip C-MOS Etc., No. 186, Nov. 1976.

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