Process for manufacturing a high conductivity insulated gate bip

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 40, 437 6, 437154, H01L 21265

Patent

active

057233497

ABSTRACT:
A high conductivity IGBT integrated structure comprises a heavily doped semiconductor substrate of a first conductivity type constituting a first electrode of the IGBT, a lightly doped semiconductor layer of a second conductivity type superimposed over the substrate, at least one first doped region of the first conductivity type extending from a top surface of the lightly doped layer thereinto and constituting a channel region of the IGBT, and a second doped region of the second conductivity type extending from said top surface into the first doped region and constituting a second electrode of the IGBT. A buried layer of semiconductor material is sandwiched between the substrate and the lightly doped layer and is constituted by heavily doped regions of the second conductivity type intercalated with lightly doped regions of the second conductivity type.

REFERENCES:
patent: 4047220 (1977-09-01), Ferro et al.
patent: 4072975 (1978-02-01), Ishitani
patent: 4233615 (1980-11-01), Takemoto et al.
patent: 4305974 (1981-12-01), Abe et al.
patent: 4376286 (1983-03-01), Lidow et al.
patent: 4588960 (1986-05-01), Salama et al.
patent: 5200632 (1993-04-01), Sakurai
patent: 5264378 (1993-11-01), Sakurai
patent: 5270230 (1993-12-01), Sakurai
IEEE, Ind. Appt. Soc. Annu. Meeting, 1980, pp. 682-688, P.L. Hower, "A Comparison of Bipolar And Field-Effect Transistors as Power Switches".
International Electron Devices Meeting, Tech. Digest, Dec. 8-10, 1980, Washington D.C., pp. 787-790 W. Donnison, et al., "Subsurface Junction Field Effect Transistor (SJET)".
The Theory of Practice of Microelectronics, Chapters 4, 6, 7, 8, 10, 13, and 15, Ghandi.
Physics and Technology of Semiconductor Devices, A.S. Grove, Intel Coporation, Mountain View, University of California, Berkeley, Chapters 3, 4, 6, 8, 9, 10 and 11.
European Search Report from European Patent Application No. 94830028.0, filed Jan. 27, 1994.
Patent Abstracts of Japan, vol. 11, No. 55 (E-481) (2502) 20 Feb. 1987 & JP-A-61 216 363 (Toshiba Corp.) 26 Sep. 1986.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for manufacturing a high conductivity insulated gate bip does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing a high conductivity insulated gate bip, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing a high conductivity insulated gate bip will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2246892

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.