Polyimide-metal foil composite film

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428334, 428335, 428337, 428339, 428458, 4284735, B32B 702, B32B 1508

Patent

active

057232067

ABSTRACT:
A polyimide-metal foil composite film comprising a conductive metal foil having directly laminated on at least one surface thereof a polyimide resin layer which comprises repeating units represented by formulae (1) and (2) as described hereinabove. The polyimide-metal foil composite film can be used as a circuit substrate having excellent dimensional stability under high temperature.

REFERENCES:
patent: 4916009 (1990-04-01), Hino et al.
patent: 4937133 (1990-06-01), Watanabe et al.
patent: 5601905 (1997-02-01), Watanabe et al.

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