Power module with isolated substrates cooled by integral heat-en

Details Power module with isolated substrates cooled by integral heat-en Power module with isolated substrates cooled by integral heat-en

1977-06-13

1979-03-20

Wojciechowicz, Edward J.

357 80, 357 81, H01L 2504

Patent

active

041457080

ABSTRACT:
The evaporating area of a heat pipe or thermosiphon evaporator is used as the thermal sink for one face of an electrically isolated substrate upon the opposite face of which are mounted and interconnected one or more power semiconductors and other components requiring cooling. Both sides of semiconductor devices mounted on the isolating substrate may be cooled while allowing each of a plurality of different combinations of electrical devices and/or interconnections to be achieved.

REFERENCES:
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4069497 (1978-01-01), Steidlitz

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