Plastic encapsulated semiconductor devices

Details Plastic encapsulated semiconductor devices Plastic encapsulated semiconductor devices

1978-05-05

1978-11-07

Wojciechowicz, Edward J.

357 72, 357 80, 357 81, H01L 2348

Patent

active

041248643

ABSTRACT:
A plastic packaged semiconductor device having a heat sink includes a semiconductor device which requires ultrasonically bonded leads. External leads are attached to the heat sink and have end portions to which ultrasonic bonds can be made. The lead end portions are separated from the heat sink by a body of insulating material. Preferably, the insulating material is an epoxy adhesive which may contain reinforcing glass fibers.

REFERENCES:
patent: 3820153 (1974-06-01), Quinn
patent: 3969752 (1976-07-01), Martin et al.
patent: 4023198 (1977-05-01), Malone et al.

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