Apparatus for encapsulating selected portions of a printed circu

Details Apparatus for encapsulating selected portions of a printed circu Apparatus for encapsulating selected portions of a printed circu

1988-02-29

1989-08-29

Woo, Jay H.

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

249 96, 249119, 26427215, 26427217, 425127, 425388, 425546, 425556, 425572, 425573, 425588, B29C 4514

Patent

active

048612510

ABSTRACT:
An apparatus for encapsulating selected portions of the printed circuit board in a pin grid array using transfer molding techniques. In one embodiment for encapsulating only the top surface and side edges of the board, a vacuum is provided in the lower cavity to hold the edges of the bottom surface of the board flush against the mold plate. In a second embodiment for encapsulating all exposed surfaces of the board, the array pins are inserted in holes in the bottom of the cavity and supported by an adjustable block which positions the board in the cavity.

REFERENCES:
patent: 3247550 (1966-04-01), Haines, Jr.
patent: 4332537 (1982-06-01), Slepcevic
patent: 4546951 (1985-10-01), Boschman
patent: 4688152 (1987-08-01), Chia

Affiliated with

Also associated with

Rating

Apparatus for encapsulating selected portions of a printed circu does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for encapsulating selected portions of a printed circu, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for encapsulating selected portions of a printed circu will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2234840