Laser processing method

Details Laser processing method Laser processing method

1996-05-20

1999-04-13

Evans, Geoffrey S.

Electric heating

Metal heating

By arc

438487, B23K 2600

Patent

active

058939903

ABSTRACT:
A device-forming region where a semiconductor device is formed is arranged on a substrate in the matrix of 2.times.2. A linear laser beam has a cross-section having a length longer than the width of the device-forming region. When the irradiation of the laser beam is performed, the region irradiated with the end portions of the linear laser beams overlapped with each other or brought into contact with each other, is made positioned outside the device-forming region.

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patent: 4309225 (1982-01-01), Fan et al.
patent: 5357365 (1994-10-01), Ipposhi et al.
patent: 5365875 (1994-11-01), Asai et al.
patent: 5413958 (1995-05-01), Imahashi et al.
patent: 5432122 (1995-07-01), Chae
patent: 5561081 (1996-10-01), Takenouchi et al.
patent: 5578520 (1996-11-01), Zhang et al.

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