Microelectronic device package employing capacitively coupled co

Details Microelectronic device package employing capacitively coupled co Microelectronic device package employing capacitively coupled co

1991-03-04

1992-06-02

Davie, James W.

357 65, 357 74, 357 84, H01L 2378

Patent

active

051191725

ABSTRACT:
A microelectronic device including a passivation layer disposed on the top surface has disposed on a portion of its surface a bonding agent. The resulting structure is inverted and sealed to a package base, forming a hermetically sealed cavity. This protects the microelectronic device from the environment. External electrical connection to other electronic apparatus is effected by means of conductors disposed on the package base surface. Alternating current (AC) capacitive coupling contacts allow electrical coupling to the microelectronic device and prevent violation of the integrity of the passivation layer. This method realizes compact microelectronics device packages which can be mass produced from entire microelectronic device substrates.

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