Integrated high-voltage bipolar power transistor and low voltage

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437 59, 148DIG9, 357 43, H01L 21265, H01L 2170

Patent

active

051186357

ABSTRACT:
A description is given of two versions of an integrated structure in the emitter switching configuration comprising a high-voltage bipolar power transistor and a low-voltage MOS power transistor. In the vertical MOS version, the emitter region of the bipolar transistor is completely buried, partly in a first N- epitaxial layer and partly in a second N- epitaxial layer; the MOS is located above the emitter region. The bipolar is thus a completely buried active structure. In the horizontal MOS version, in a N- epitaxial layer there are two P+ regions, the first, which constitutes the base of the bipolar transistor, receives the N+ emitter region of the same transistor; the second receives two N+ regions which constitute the MOS source and drain regions, respectively; the front of the chip is provided with metal plating to ensure the connection between the MOS drain and the bipolar emitter contacts.

REFERENCES:
patent: 4881119 (1989-11-01), Paxman et al.
patent: 4935799 (1990-06-01), Mori et al.

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