Light-sensitive microcapsule containing polymerizable compound a

Radiation imagery chemistry: process – composition – or product th – Microcapsule – process – composition – or product

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430227, 430255, 264 4, 4284022, 42840222, G03C 172

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active

051185903

ABSTRACT:
A light-sensitive microcapsule contains silver halide, an ethylenically unsaturated polymerizable compound and pigment particles. Another light-sensitive microcapsule contains a photopolymerization initiator, an ethylenically unsaturated polymerizable compound and pigment particles. According to the present invention, the pigment particles are surface treated to be lipophilic. The pigment particles are preferably treated with a surface treating agent such as a lipophilic resin or an oil-soluble surface active agent. The light-sensitive microcapsule is advantageously employed in a light-sensitive material comprising a support and a light-sensitive layer in which the microcapsules are dispersed.

REFERENCES:
patent: 4629676 (1985-12-01), Hayakawa et al.
patent: 4851318 (1989-07-01), Hsieh et al.
patent: 4855209 (1989-08-01), Martin et al.
patent: 4885224 (1989-12-01), Yamamoto et al.
patent: 4889786 (1989-12-01), Takahashi
patent: 4910115 (1990-03-01), Simpson et al.
patent: 4952474 (1990-08-01), Tsukahara et al.
patent: 4954417 (1990-09-01), Nakamura et al.

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