Adhesive tape and use thereof

Details Adhesive tape and use thereof Adhesive tape and use thereof

1989-07-14

1992-06-02

Davis, Jenna L.

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428355, C09J 702

Patent

active

051185679

ABSTRACT:
An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

REFERENCES:
patent: 4218279 (1980-08-01), Green
patent: 4286047 (1981-08-01), Bennett
patent: 4756968 (1988-07-01), Ebe
patent: 4913960 (1990-04-01), Kuroda

Affiliated with

Also associated with

Rating

Adhesive tape and use thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Adhesive tape and use thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Adhesive tape and use thereof will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2227613