Method of attaching semiconductor die to package substrates

Details Method of attaching semiconductor die to package substrates Method of attaching semiconductor die to package substrates

1975-04-28

1976-05-18

Tupman, W.

Metal working

Method of mechanical manufacture

Electrical device making

29576S, 228110, 228123, 228180A, 228263, B01J 1700

Patent

active

039568210

ABSTRACT:
A method of attaching semiconductor die to package substrates, which employs a zinc-aluminum alloy. The alloy is formed into the shape of a platelet. The platelet is melted on the die attach surface of a package substrate, and the semiconductor die is bonded to the substrate by cooling to solidify the alloy.

REFERENCES:
patent: 3544857 (1970-12-01), Byrne
patent: 3698075 (1972-10-01), Boyle
patent: 3844029 (1974-10-01), Dibugnara
patent: 3883946 (1975-05-01), Dale
patent: 3922775 (1975-12-01), Potter

Affiliated with

Also associated with

Rating

Method of attaching semiconductor die to package substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of attaching semiconductor die to package substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of attaching semiconductor die to package substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2226469