Semiconductor device including package with improved base-to-cop

Details Semiconductor device including package with improved base-to-cop Semiconductor device including package with improved base-to-cop

1993-02-09

1994-06-21

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257710, 257666, H01L 2302, H01L 2312

Patent

active

053230582

ABSTRACT:
A semiconductor device includes: a base and a cap having sealing surfaces furnished with a structure to prevent outflow of resin on the inner side of each corner thereof; and a lead frame arranged between the sealing surfaces of the base and the cap, with a part of the lead frame extending into each corner of the sealing surfaces, whereby the generation of recesses and holes in the resin sealing portion is prevented and a high-quality semiconductor device can be obtained which provides a satisfactory production yield.

REFERENCES:
patent: 4575748 (1986-03-01), Terui et al.

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