Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent
1997-12-15
1999-04-13
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
438106, 438107, H01L 2144, H01L 2148, H01L 2150
Patent
active
058937269
ABSTRACT:
A semiconductor package includes a substrate having one or more dice mounted thereto, and a cover adapted to protect and form a sealed space for the dice. The cover can be pre-fabricated of molded plastic, or stamped metal, and attached to the substrate using a cured seal. A hole can also be provided through the substrate to permit pressure equalization during formation of the seal. The cover can be prefabricated in an enclosed configuration for attachment directly to the substrate, or in a planar configuration for attachment to a peripheral ridge on the substrate. In either embodiment, the cover is removable to permit defective dice to be replaced or repaired.
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Van Zant, Peter, Microchip Fabrication -A Practical Guide to Semi-conductor Processing, pp. 482-483, 1990.
Akram Salman
Farnworth Warren M.
Gochnour Derek
Hembree David R.
Jacobson John O.
Collins Deven
Gratton Stephen A.
Micro)n Technology, Inc.
Picardat Kevin M.
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