Method for packaging a semiconductor device

Details Method for packaging a semiconductor device Method for packaging a semiconductor device

1993-03-15

1993-11-16

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 7, 437 8, 437215, 437217, H01L 2160

Patent

active

052623556

ABSTRACT:
This invention is directed to a method for packaging a semiconductor flip chip on a substrate by face-down bonding in which coherent light is used to irradiate a bonding head and the substrate, and the light reflected by the bonding head and the substrate form interference patterns. Adjustment of the inclination of the bonding head against the substrate is performed by observation of the interference fringes caused by the interference between the light reflected by the bonding head and the light reflected by the substrate.

REFERENCES:
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patent: 4677473 (1987-06-01), Okamoto et al.
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patent: 4899921 (1990-02-01), Bendat et al.
patent: 4902631 (1990-02-01), Downey et al.
Serway, "Interference of Light Waves", Physics for Scientists and Engineers, 1982, p. 791.

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