Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent
1997-11-17
2000-06-06
Ballato, Josie
Electricity: measuring and testing
Fault detecting in electric circuits and of electric components
Of individual circuit component or element
324757, 324765, G01R 3102
Patent
active
060723211
ABSTRACT:
A probe card for testing semiconductor dice contained on a wafer and a method for fabricating the probe card are provided. The probe card includes a substrate preferably formed of silicon, and having a pattern of contact members corresponding to a pattern of test pads on the wafer. Each contact member is formed integrally with the substrate and includes a projection formed as an elongated blade adapted to penetrate into a corresponding test pad to a limited penetration depth. In addition, a cavity and a flexible membrane are formed in the substrate subjacent to the contact members to permit flexure of the contact members. Fluid or gas pressure can be introduced into the cavity through flow passages formed in the substrate.
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"Science Over Art. Our New IC Membrane Test Probe", Packard Hughes Interconnect advertising brochure, 1991. (Month Unavailable).
Akram Salman
Hembree David R.
Wood Alan G.
Ballato Josie
Gratton Stephen A.
Kobert Russell M.
Micro)n Technology, Inc.
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