Electric heating – Metal heating – For bonding with pressure
Patent
1985-09-13
1987-03-31
Goldberg, E. A.
Electric heating
Metal heating
For bonding with pressure
219 85BA, 219 85R, 2281801, B23K 104, B23K 119
Patent
active
046545026
ABSTRACT:
A multi-zone thermal process system utilizing nonfocused infrared panel emitters. An insulated housing has a plurality of zones each having separate panel emitters which heat a product load traveling through the zone and in close proximity to said panel(s) at different peak wavelengths in each zone. The panel emitters emit infrared wavelengths in the middle and far regions. The temperature differences across each zone and between the panel and product are held to a minimum. A specific application of the system is for accomplishing reflow soldering of surface mount devices to printed circuit boards.
REFERENCES:
patent: 3583063 (1971-06-01), Growney
patent: 3588425 (1971-06-01), Erickson
patent: 3649803 (1972-03-01), Desmond et al.
patent: 3756489 (1973-09-01), Chartet
patent: 4504008 (1985-03-01), Kent et al.
"Infrared Conveyor Dryer/Oven", Vitronics Corporation Brochure, Jan. 1983.
"Infrared Conveyorized Solder Reflow Systems", Vitronics Corporation Brochure, Jan. 1984.
Crawford, D. J., et al, "Soldering Process for Components on Printed Circuit Cards" IBM Technical Disclosure Bulletin vol. 22, No. 5, Oct. 1979.
Goldberg E. A.
Sigda Catherine M.
Vitronics Corporation
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