Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Patent
1996-11-13
2000-06-06
Graybill, David E.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
438123, 26427217, H01L 2150, B29C 1300
Patent
active
060717580
ABSTRACT:
A method for the manufacture of a micromodule with surface flush connector, the metallic regions of the connector being formed on a support grid, comprises the formation of protection barriers between the regions of the connector so as to form a closed contour demarcating a molding zone around the chip, outside a standardized space reserved for the physical connections between the connector of the micromodule and an external system, to make a molding of thermohardening or thermoplastic material around the chip in this demarcated molding zone.
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Galanthay Theodore E.
Graybill David E.
Morris James H.
SGS-Thomson Microelectronics S.A.
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