Apparatus for encapsulating electronic components in plastic mat

Details Apparatus for encapsulating electronic components in plastic mat Apparatus for encapsulating electronic components in plastic mat

1983-08-16

1987-03-31

Lowe, James

Plastic article or earthenware shaping or treating: apparatus

Distinct means to feed, support or manipulate preform stock...

Opposed registering coacting female molds

26427217, 425121, 425126R, 425129R, 425543, B29C 4514, B29C 3104

Patent

active

046539930

ABSTRACT:
Apparatus for encapsulating parts of elements into a plastic material to manufacture electronic components. The mould has one or more parallel rows of mould cavities, into which a plastic material is injected through one or more sprues. The elements are part of a strip of which the length is a multiplicity of the length of a row of cavities, which strip is step by step treated in said mould such that an uninterrupted strip of components is obtained.

REFERENCES:
patent: 3471900 (1969-10-01), Burns
patent: 3915780 (1975-10-01), Broussard, Jr. et al.
patent: 4109373 (1978-08-01), Fennessy et al.
patent: 4173821 (1979-11-01), Yamamoto
patent: 4250347 (1981-02-01), Fierkens
patent: 4347211 (1982-08-01), Bandoh
patent: 4368168 (1983-01-01), Slepcevic
patent: 4386898 (1983-06-01), Sera
patent: 4388265 (1983-06-01), Bandoh
patent: 4460537 (1984-07-01), Heinle
PCT/JP82/00023, Aug. 5, 1982.

Affiliated with

Also associated with

Rating

Apparatus for encapsulating electronic components in plastic mat does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Apparatus for encapsulating electronic components in plastic mat, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Apparatus for encapsulating electronic components in plastic mat will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2210550