Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1997-05-14
2000-06-06
Crispino, Richard
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156252, 156253, 156256, 156277, 283 98, 283101, 283103, 283105, 283106, 493233, 493356, 493399, 493919, B32B 3100
Patent
active
060713674
ABSTRACT:
A method for forming and using a mailpiece requiring special services is provided. The method includes providing a mailpiece having an integral document section requiring special service mailing that includes folding the sheet along fold lines and sealing the mailpiece to enclose the integral document section. The method further includes providing a removably attached section which, after the system is folded and sealed, forms a return postcard and at least one form. The return postcard and the form are integrally formed, but removably attached. The method includes removing the return postcard when the mailpiece is received by the addressee.
REFERENCES:
patent: 1043243 (1912-11-01), Mitchell
patent: 1311397 (1919-07-01), Herter
patent: 2279164 (1942-04-01), Gettleman
patent: 2983431 (1961-05-01), Turan
patent: 2985464 (1961-05-01), McFarland
patent: 3406894 (1968-10-01), Settle
patent: 3837565 (1974-09-01), Johnsen
patent: 3937492 (1976-02-01), Biron
patent: 4682793 (1987-07-01), Walz
patent: 4918128 (1990-04-01), Sakai
patent: 4951864 (1990-08-01), Dicker
patent: 5174493 (1992-12-01), File
patent: 5183203 (1993-02-01), Sanders
patent: 5201464 (1993-04-01), File
patent: 5203851 (1993-04-01), Browning et al.
patent: 5253798 (1993-10-01), Lombardo
patent: 5366145 (1994-11-01), Sauerwine
patent: 5553774 (1996-09-01), Goodno
patent: 5595404 (1997-01-01), Skees
patent: 5622390 (1997-04-01), Jenkins
patent: 5890647 (1999-04-01), Petkovsek
Crispino Richard
Gray Linda L
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