Power distribution system for a multi-layer circuit board having

Details Power distribution system for a multi-layer circuit board having Power distribution system for a multi-layer circuit board having

1997-02-13

1998-06-09

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174261, 174260, 361775, 361777, 361780, 361782, 361818, H01R 909, H05K 116, H05K 706, H05K 900

Patent

active

057644918

ABSTRACT:
A power distribution system for a multi-layer circuit board includes a board having a component layer with signal runs formed thereon, a ground layer, an insulation layer, and a power supply system. The power supply system includes a supply bus, discrete voltage supply planes, and isolation devices mounted on the component layer, each connecting one of the discrete voltage supply planes to the supply bus. The component layer has a first area for components which perform a first function and a second area for components which perform a second function. The discrete voltage supply planes include a first supply plane corresponding to the first area and a second supply plane corresponding to the second area. The first supply plane is disposed directly beneath and is shaped substantially the same as the first area, and the second supply plane is disposed directly beneath and is shaped substantially the same as the second area. The first supply plane, the second supply plane, and the supply bus lie in a plane between the insulation layer and the component layer.

REFERENCES:
patent: 4984132 (1991-01-01), Sakurai et al.
patent: 5023753 (1991-06-01), Abe
patent: 5068631 (1991-11-01), Vince
patent: 5131140 (1992-07-01), Zimmer
patent: 5488540 (1996-01-01), Hatta

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