Lamination molding method and an apparatus thereof

Details Lamination molding method and an apparatus thereof Lamination molding method and an apparatus thereof

1998-09-11

2000-09-05

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156285, 156382, 1565833, B32B 3100

Patent

active

061137243

ABSTRACT:
A lamination apparatus having an upper platen and a lower platen that open and close to define a lamination chamber therebetween, an electric heater to melt a resin layer of the material to be laminate-molded, a film body provided on the surface of the lower platen, a smooth pressurizing surface formed on the surface of the upper platen, a frame which forms a wall of the lamination chamber in which the material to be laminate-molded is shaped by being clamped between the opposing surfaces of the upper platen and the lower platen, a suction device to depressurize the lamination chamber, a deformable pressurizing plate resiliently interposed between the film body and the material to be laminate-molded and a contact pressurizing mechanism which cause the film body to maintain contact with the surface of the lower platen and separate therefrom to pressurize the material to be laminate-molded through the pressurizing plate pressing against the pressurizing surface of the upper platen.

REFERENCES:
patent: 5558015 (1996-09-01), Miyashita et al.

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