Press-fit semiconductor package

Details Press-fit semiconductor package Press-fit semiconductor package

1999-03-25

2000-12-12

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

257687, 257688, 257689, 257694, 257731, H01L 2306, H01L 2348

Patent

active

061603090

ABSTRACT:
A press-fit package, such as a press-fit rectifier, includes an improved cup design which incorporates a mold lock formed within the inner wall of the cavity. a well is provided between the inner cavity wall and the die bond area to assist in mechanical decoupling of the press-fit force and the semiconductor die. An insert profile is formed along the outer surface of the cup to assist in proper alignment of the press-fit package during assembly, and a small lip is formed around the perimeter of the die bond area.

REFERENCES:
patent: 3717523 (1973-02-01), Dunsche
patent: 3743896 (1973-07-01), Weike et al.
patent: 4303935 (1981-12-01), Ragaly
patent: 4498096 (1985-02-01), Addie et al.
patent: 4532539 (1985-07-01), Frister
patent: 5005069 (1991-04-01), Wasmer et al.
patent: 5206793 (1993-04-01), Boudrant et al.
patent: 5302856 (1994-04-01), Narita et al.
patent: 5424594 (1995-06-01), Saito et al.
patent: 5886403 (1999-03-01), Yoshinaga et al.

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