Special receptacle or package – For a vehicle
Patent
1985-05-14
1987-03-31
Price, William
Special receptacle or package
For a vehicle
118500, 206454, 211 41, 432259, B05C 1302, B65D 2502
Patent
active
046536361
ABSTRACT:
A quartz wafer boat or carrier includes three slotted parallel members, each member including a plurality of grooves aligned with corresponding slots in the other members, for carrying semiconductor wavers in precise spaced parallel relationship to each other. The bottom member is located in substantially offset relationship to the center of gravity of the supported wafers. A first side member is located in substantial offset relationship to the opposite side of the center of gravity, so that the bottom member and the first side member completely support the wafers. A third side member is located on the same side of the center of gravity of the wafers as the bottom member, but normally does not support the wafers, but retains them if the wafer boat is accidentally tilted. The slots in the second side member are deep enough to prevent the edges of the supported wafers from contacting the bottoms of those slots as a result of thermal expansion of the supported wafers, to avoid binding and stressing thereof.
REFERENCES:
patent: 3889815 (1975-06-01), Merle
patent: 3998333 (1976-12-01), Kamada
patent: 4176751 (1979-12-01), Gillissie
patent: 4244673 (1981-01-01), Henderson
patent: 4256229 (1981-03-01), Lee
patent: 4287851 (1981-09-01), Dozier
patent: 4355974 (1982-10-01), Lee
patent: 4461386 (1984-07-01), Turner et al.
patent: 4548159 (1985-10-01), Foster et al.
"Diffusion Boat", Defries, IBM Technical Disclosure Bulletin, vol. 11, No. 12, May 1969.
Foster Jimmy G.
Microglass, Inc.
Price William
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