Semiconductor wafer divisible into chips for creating or recordi

Details Semiconductor wafer divisible into chips for creating or recordi Semiconductor wafer divisible into chips for creating or recordi

1996-01-16

1997-09-16

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Physical configuration of semiconductor

257620, 257622, H01L 2906

Patent

active

056684002

ABSTRACT:
Semiconductor chips, such as photosensor arrays for a full-page-width scanner or printhead chips for a full-page-width ink-jet printer, are mounted on a substrate to maintain reasonably consistent spacing among adjacent chips. To remove a defective chip from the array, the substrate is urged evenly against a work surface defining a convex bow. Alternately, back-cuts are provided along abutting edges of the chips, and the silicon around these back-cuts can be sawed away to space defective chips from neighboring good chips. By increasing the spacing of a defective chip from neighboring chips, the defective chip can be removed while minimizing the risk of damage to neighboring chips. Also, batches of chips can be originally manufactured on a single wafer as either "regular" chips or "replacement" chips, with the replacement chips being slightly shorter in a critical dimension.

REFERENCES:
patent: 4860075 (1989-08-01), Araghi et al.

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