Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent
1993-12-29
1995-01-03
Heinrich, Samuel M.
Metal fusion bonding
Process
Metal to nonmetal with separate metallic filler
2281231, 228138, 228212, B23K 3102, B23K10136
Patent
active
053779002
ABSTRACT:
A method of mechanically mating two workpieces when one of the workpieces lacks physically matable surface characteristics. An adaptor is formed through crystallographic etching techniques and is precisely positioned and mounted to the surface of the workpiece lacking physical features in order to provide mechanical points of contact for mating with the other workpiece. Solder points are formed on the surface of the workpiece and the adaptor by photolithographic metalization. The adaptor is then solder bump mounted to the surface of the workpiece for highly precise positioning. The adaptor forms precisely positioned points of contact for mechanical mating with the physical features of the other workpiece.
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patent: 4907733 (1990-03-01), Pratt et al.
patent: 4962446 (1990-10-01), Asakura et al.
patent: 5215244 (1993-06-01), Buchholz et al.
Wade, Michael J. and Edge, Colin, "Self-Aligned Flip-Chip Assembly of Photonic Devices with Electrical and Optical Connections", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 13, No. 4, Dec. 1990, pp. 780-786.
Petersen, Kurt E., "Silicon as a Mechanical Material", Proceedings of the IEEE, vol. 70, No. 5, May 1982, pp. 420-457.
AT&T Corp.
Heinrich Samuel M.
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