Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-07-22
1998-06-09
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257706, H01L 2334
Patent
active
057639515
ABSTRACT:
A liquid cooling system contained completely on a circuit board assembly. The liquid cooling system uses microchannels etched within the circuit board, those microchannels being filled with electrically conductive fluid that is pumped by a non-mechanical, magnetic pump. The pump can be separate from the device on the circuit board which is to be cooled or it can be integrated with the device that is to be cooled. In the latter circumstance, the same current which flows through the electronic device is the current which generates the Lorentz force that pumps the electrically conductive fluid through the microchannel.
REFERENCES:
patent: 2612109 (1952-09-01), Wakefield
patent: 5380956 (1995-01-01), Loo et al.
patent: 5522452 (1996-06-01), Mizuno et al.
patent: 5620646 (1997-04-01), Sparer et al.
Hamilton Robin E.
Kennedy Paul G.
Vale Christopher R.
Clark S. V.
Northrop Grumman Corporation
Saadat Mahshid D.
Sutcliff Walter G.
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