Infrared transceiver package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – In combination with or also constituting light responsive...

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257 98, 257100, H01L 2715, H01L 3112, H01L 3300

Patent

active

057639000

ABSTRACT:
An infrared transceiver packaging hardware including a substrate, a plurality of infrared emitting and receiving elements (IC, photoelectric diode or transistor, contact pins) fastened to the substrate by a wire bonding technique, a shielding case covered on said substrate and connecting it to earth, and an insert mode die filled up with a bonding compound, the shielding case with the substrate being inserted into the bonding compound in the insert mode die, and then sealed with the bonding compound together through a backing process.

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