Encapsulating moisture-proof coating

Details Encapsulating moisture-proof coating Encapsulating moisture-proof coating

1980-08-25

1982-04-27

Smith, John D.

Plastic and nonmetallic article shaping or treating: processes

Outside of mold sintering or vitrifying of shaped inorganic...

Including plural heating steps

26427211, 174 52PE, 427 82, H01L 2330

Patent

active

043273696

ABSTRACT:
A resin formulation, especially adapted for use in the encapsulating of electronic or electric devices, is provided. The formulation comprises a thermosettable resin composition to which has been added an effective amount of a trialkoxyorgano-metal silane compound. The formulation also preferably includes a solid filler material.

REFERENCES:
patent: 3788895 (1974-01-01), Schimmer
patent: 3849187 (1974-11-01), Fetscher
patent: 3931026 (1976-01-01), Berkner
patent: 3946427 (1976-03-01), Iwasawa
patent: 3975757 (1976-08-01), Sporck
patent: 4017340 (1977-04-01), Yerman
patent: 4129543 (1978-12-01), Kaplan
patent: 4136080 (1979-01-01), Berger
patent: 4173683 (1979-11-01), Comizzoli

Affiliated with

Also associated with

Rating

Encapsulating moisture-proof coating does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Encapsulating moisture-proof coating, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Encapsulating moisture-proof coating will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2200408