Method and apparatus for waste heat removal from a computer encl

Details Method and apparatus for waste heat removal from a computer encl Method and apparatus for waste heat removal from a computer encl

1995-07-20

1997-03-25

Joyce, Harold

Ventilation

Electronic cabinet

361678, 361695, H05K 720

Patent

active

056139063

ABSTRACT:
A hot-air chimney for a computer in an enclosure, for the purpose of removing hot air generated by ICs within the enclosure, is fabricated in the shape and form of an expansion card for the computer. The chimney has a base panel in the shape of the expansion card, and an enclosed passage formed on the base panel. The chimney also has an end flange fashioned to simulate an end panel of the expansion card, and the enclosed passage is open to an opening in the end flange. In computers wherein expansion cards are installed parallel to and overlying a motherboard, the hot-air chimney is installed in place of an expansion card adjacent to the motherboard. An opening positioned in the base panel into the enclosed passage, and positioned to overlie a heat-producing IC on the motherboard, conducts heated air from the IC into the enclosed package and then outside the enclosure via the opening in the end flange. The chimney is particularly effective for computers with fan-mounted ICs, such as a CPU with a cooling fan. In some embodiments an EMI-grounding grid is provided over the opening in the end flange of the hot-air chimney.

REFERENCES:
patent: 3039377 (1962-06-01), Wernli
patent: 4356531 (1982-10-01), Marino et al.
patent: 4931904 (1990-06-01), Yiu
patent: 5287009 (1994-02-01), Heung
patent: 5412534 (1995-02-01), Cutts et al.
patent: 5456632 (1995-10-01), Ohtsu et al.

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