Method of making a machine structures fabricated of mutiple micr

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates

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216 2, 310 40MM, H01L 2130

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057633185

ABSTRACT:
Machine structures each comprising a stack of a plurality of micromachine layers laminated together are presented, along with fabrication methods therefore. Each machine structure includes a movable member(s) defined from microstructure of at least one layer of the plurality of micromachine layers comprising the stack. During fabrication, the micromachine layers are separately formed using VLSI techniques and then subsequently laminated together in a selected arrangement in the stack to define the machine structure.

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