Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Patent
1996-12-24
1998-06-09
Dutton, Brian
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
216 2, 310 40MM, H01L 2130
Patent
active
057633185
ABSTRACT:
Machine structures each comprising a stack of a plurality of micromachine layers laminated together are presented, along with fabrication methods therefore. Each machine structure includes a movable member(s) defined from microstructure of at least one layer of the plurality of micromachine layers comprising the stack. During fabrication, the micromachine layers are separately formed using VLSI techniques and then subsequently laminated together in a selected arrangement in the stack to define the machine structure.
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Bertin Claude Louis
Cronin John Edward
Dutton Brian
International Business Machines - Corporation
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