Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1980-11-10
1982-04-27
Kendall, Ralph S.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 98, 427305, 427367, 427370, 204 38B, C23C 302
Patent
active
043271260
ABSTRACT:
A process of making printed circuit boards in which the individual substrates involved are hot set formed from a suitable thermosetting resin and filler composition, with the cure being limited to the resin B stage. The side surfacing of the individual substrates that is to bear the metallic electrically conductive circuiting is catalyzed and then electrolessly plated with copper or the like electrically conductive metallic material to a thickness in the range of from about 50 to about 100 millionths of an inch, and thereafter the thusly plated substrates are hot set to fully cure same and perfect the bond between the substrate and its plating. Each substrate then has a masking and non-conductive resist applied to its plated side (that is to bear the circuit), in a pattern that defines the printed circuit configuration and exposes the underlining electroless plating in the configuration of the circuit for electroplating, after which the substrate is electroplated with copper or the like in the circuit defining voids of the resist thereafter, the resist is stripped from the substrate, and the electroless plating thereby exposed is removed by etching.
REFERENCES:
patent: Re29015 (1976-10-01), DeAngelo et al.
patent: 2721152 (1955-10-01), Hopt et al.
patent: 3060062 (1962-10-01), Katz et al.
patent: 3666549 (1962-05-01), Rhodenizer et al.
patent: 3698940 (1972-10-01), Mersereau et al.
patent: 3959523 (1976-05-01), Grunwald et al.
patent: 4216576 (1980-08-01), Ammon
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