Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – Automatic and/or material-triggered control
Patent
1987-02-06
1988-12-13
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
Automatic and/or material-triggered control
156354, 156355, 156513, 156516, 156517, 156521, 156529, 156555, B32B 3118
Patent
active
047908955
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a punching device and, more particularly, to a technique effective for application to a film punching device for use with a laminater.
BACKGROUND ART
Printed-wiring boards to be used for electronic equipment such as computers are prepared by forming a determined pattern of wiring of copper or the like on one or both sides of an insulating substrate.
Printed-wiring boards of this kind may be prepared by the following manufacturing steps.
First, a laminated film consisting of a photosensitive resin (photoresist) layer and a translucent resin film (protective layer) protecting the photosensitive resin layer is laminated by thermocompression bonding on a conductive layer mounted on an insulating substrate. The lamination by thermocompression bonding may be conducted on a large scale using a film laminating apparatus or a so-called laminater. Thereafter, a wiring pattern film is superposed on the laminated film, and the photosensitive resin layer is exposed for a determined period of time through the wiring pattern film and the translucent resin film. After the translucent resin film is peeled off using a peeling device, the exposed photosensitive resin layer is developed to form an etching mask pattern. Thereafter, unnecessary portions of the conductive layer are removed by etching and further the remaining photosensitive resin layer is removed, thereby producing a printed-wiring board with a predetermined wiring pattern.
In the manufacturing steps of the printed-wiring boards as described above, it is necessary during the step of exposing the photosensitive resin layer to superpose the wiring pattern film on the laminated film laminated on the substrate by thermocompression bonding. This superposition is carried out by fitting a positioning pin in a guide hole (or a positioning hole) formed at a corner or end portion of the substrate and a guide hole (or a positioning hole) formed on the wiring pattern film so as to correspond to the above guide hole. Since the laminated film is laminated on the substrate, a hole for fitting the positioning pin is formed on the laminated film by punching at the position corresponding to the guide hole on the substrate prior to the fitting of the positioning pin. The punching of the laminated film may be effected manually using a drill or a punch or mechanically using a punching device for exclusive use after the laminated film has been laminated on the substrate by thermocompression bonding.
However, manual or mechanical punching of the laminated film causes problems, resulting in extremely poor work efficiency.
In forming a hole by punching the laminated film, chips of the laminated film are scattered on the laminated film on which a wiring pattern is formed and it is extremely hard to clear such chips. This prevents the wiring pattern from being drawn accurately on the photosensitive resin layer, resulting in decreased yield in the manufacture of printed-wiring boards.
DISCLOSURE OF THE INVENTION
The object of the present invention is to provide a laminater capable of improving work efficiency.
Other objects of the present invention are to provide a laminater capable of improving manufacturing yield, in addition to achieving the above object.
The present invention is characterized in that, in a laminater for laminating a film, which is cut to a predetermined length, on a substrate with positioning holes, a punching device for forming through-holes of predetermined sizes on the film at positions corresponding to the positioning holes of the substrate is disposed at a predetermined position on a film feeding passage along which the film is fed from a film feeding apparatus to the substrate. With this arrangement, the present invention can form through holes at the through-hole positions on the film corresponding to the positions of the positioning holes on the substrate prior to or during lamination of the film on the substrate so that work efficiency can be improved.
The present invention is also characterized in that,
REFERENCES:
patent: 4585509 (1986-04-01), Obayashi
patent: 4659419 (1987-04-01), Miyake
patent: 4680079 (1987-07-01), Tanaka
Somar Corporation
Weston Caleb
Yee Stephen F. K.
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