Integrated processor board assembly

Facsimile and static presentation processing – Facsimile – Recording apparatus

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Details

357 24, 357 30, H04N 530, H01L 3100

Patent

active

045757623

ABSTRACT:
Disclosed is an integrated processor assembly and a method for making that assembly, including the steps of providing a semiconducting substrate, fabricating integrated processing circuitry in the substrate, depositing a plurality of input strip lines from a first edge of the substrate to the circuitry, depositing a plurality of output leads from the circuitry to a second edge of the substrate, repeating these steps for a plurality of substrates, and bonding the substrates together so that the terminated input strip lines define a two dimensional array of contact points.

REFERENCES:
patent: 3748479 (1973-07-01), Lehovec
patent: 4067104 (1978-01-01), Tracy
patent: 4169273 (1979-09-01), Hendrickson
patent: 4196508 (1980-04-01), Lorenze, Jr.
patent: 4369458 (1983-01-01), Thomas et al.
patent: 4403238 (1983-09-01), Clark
patent: 4451842 (1984-05-01), Pommerrenig

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