Semiconductor element-mounting printed board

Details Semiconductor element-mounting printed board Semiconductor element-mounting printed board

1991-11-14

1993-09-28

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

361388, 361400, 361414, 361708, 361783, 361792, H05K 100

Patent

active

052488535

ABSTRACT:
A semiconductor element-mounting printed board, comprising a substrate having a thermal expansion coefficient not higher than 4.5.times.10.sup.-6 /.degree. C., a buffer layer formed on at least one of the surfaces of the substrate and having a Young's modulus not higher than 450 kg/mm.sup.2, a conductor circuit formed on a surface of the buffer layer, the conductor circuit having predetermined patterns, and a semiconductor element bonded to the conductor circuit by soldering.

REFERENCES:
patent: 4755417 (1988-07-01), Detoma
patent: 4812792 (1989-03-01), Lebowitz
patent: 4926242 (1990-05-01), Itoh et al.

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