Resin circuit substrate and manufacturing method therefor

Details Resin circuit substrate and manufacturing method therefor Resin circuit substrate and manufacturing method therefor

1990-10-22

1993-09-28

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174260, H05K 100

Patent

active

052488527

ABSTRACT:
A resin circuit substrate includes: a plurality of electronic parts having electrodes to be electrically connected to each other, with surfaces of the electrodes being disposed flush with each other; a resin for integrally molding surfaces of the electronic parts other than the surfaces of the electrodes so that the electronic parts are retained with the resin; and a circuit pattern for electrically connecting the electrodes to each other, the circuit pattern being laminated on exposed surfaces of the electrodes. A method for manufacturing the resin circuit substrate includes the steps of: positioning the electronic parts on a base having a flat surface so that surfaces of the electrodes contact the flat surface of the base; molding the electronic parts so as to be integrated with the resin on the flat surface thereof to form a molded part; hardening, drying or aging the molded part integrated with the electronic parts; removing the base from the molded part; printing a conductive resin onto the molded part to form a circuit pattern in such a manner that the conductive resin is laminated on a surface, of the molded part, including the surfaces of the electrodes; and hardening or drying the conductive resin.

REFERENCES:
patent: 3206647 (1965-09-01), Kahn
patent: 3679941 (1972-07-01), LaCombe et al.
patent: 3885304 (1975-05-01), Kaiser et al.
patent: 4143456 (1979-05-01), Inoue
patent: 4639830 (1987-01-01), Fukuoka
patent: 4751126 (1988-06-01), Oodaira et al.
patent: 4788104 (1988-11-01), Adriaensen
patent: 4984034 (1991-01-01), Yamazaki

Affiliated with

Also associated with

Rating

Resin circuit substrate and manufacturing method therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Resin circuit substrate and manufacturing method therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Resin circuit substrate and manufacturing method therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2192522